PRODUCTS

CLEAR CASTING EPOXY ENCAPSULATION SYSTEM FOR PHOTONIC DEVICES
We are offering clear casting, epoxy-anhydride encapsulation system mainly for application in LED devices (I.e. SMT, Tile Displays, Photonic & Radial devices).

It consist of a two part system, unfilled and when thermally cured, provide rigid, excellent clarity, thermal shock resistant and excellent environmental protection for the LED semiconductor.

We also produce color dye and premix epoxy to fulfill customer needs and requirement for manufacture of colored lighting unit.

To fulfill specific requirements, we also actively develop formulation which is suitable for client’s application.

Key Advantages

  • Manufacture from high purity raw materials to ensure good consistency
  • Low mixed viscosity to allow easy casting
  • Stress relieving mechanism to offer superior reliability performance
  • Lower cost
  • Customer formulation available to suit specific customer needs
Epoxy Type Description Product Code
SMD Epoxy Used for various type of PCB onboard lighting package encapsulation. SM0331UV
SM0331
SH0208
Lamp Epoxy Used for encapsulation of lamp and radial device LH0610E
LH0610
Tile Epoxy Used for tile package encapsulation TM0420
Fluorescence Epoxy Apply for epoxy encapsulation which requires fluorescence properties SA30LH10
Color Dye and Premix Epoxy Used together with other epoxy encapsulant for encapsulating various colored package

CR101 (Red)
CR102 (Red)
CG213 (Green)
CB514 (Blue)
L604 (Yellow)
L602 (Blue)

Custom Formulation Epoxy formulation based on customer specific requirement  

For more details, please download the Product’s Data Sheet.

Technical Bulletin-SH0208-E

Technical Bulletin-LH0610-J

Technical Bulletin-LH0622UV

MSDS LH0622UV Part A_-B

MSDS LH0622UV Part B_-B